SEMICONDUCTOR PACKAGE

A circuit board according to an embodiment includes an insulating layer; a first metal layer passing through upper and lower surfaces of the insulating layer; and a second metal layer disposed on the first metal layer; wherein the first metal layer includes a concave upper surface and a lower surfac...

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Bibliographic Details
Main Authors KIM, Hong Ik, JOUNG, Dong Hun, LEE, Chung Gi
Format Patent
LanguageEnglish
Published 12.09.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A circuit board according to an embodiment includes an insulating layer; a first metal layer passing through upper and lower surfaces of the insulating layer; and a second metal layer disposed on the first metal layer; wherein the first metal layer includes a concave upper surface and a lower surface, wherein the second metal layer includes a convex lower surface corresponding to the concave upper surface of the first metal layer, and wherein a first height between the convex lower surface of the second metal layer and the lower surface of the insulating layer is smaller than a second height between the upper surface of the insulating layer and the lower surface of the insulating layer.
Bibliography:Application Number: US202218275312