SUBSTRATE POLISHING APPARATUS
Provided is a substrate polishing apparatus. The substrate polishing apparatus includes a carrier configured to grip a substrate, a polishing pad configured to polish a surface to be polished of the substrate gripped by the carrier while rotating, and a temperature control assembly configured to con...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
29.08.2024
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Subjects | |
Online Access | Get full text |
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Summary: | Provided is a substrate polishing apparatus. The substrate polishing apparatus includes a carrier configured to grip a substrate, a polishing pad configured to polish a surface to be polished of the substrate gripped by the carrier while rotating, and a temperature control assembly configured to control a temperature of the polishing pad, and the temperature control assembly includes Deionized water (DIW) spraying module configured to spray DIW toward the polishing pad and a guide vane configured to guide at least a portion of the DIW sprayed from the DIW spraying module to an outside of the polishing pad. |
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Bibliography: | Application Number: US202318453322 |