SEMICONDUCTOR DEVICE

A semiconductor device includes a lead with a terminal, and a sealing resin partially covering the terminal. The lead includes a base and metal layer covering the base. The base has a first terminal-extending portion forming the terminal. The first terminal-extending portion, exposed from the sealin...

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Bibliographic Details
Main Authors ISE, Kota, SAITO, Koshun
Format Patent
LanguageEnglish
Published 22.08.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a lead with a terminal, and a sealing resin partially covering the terminal. The lead includes a base and metal layer covering the base. The base has a first terminal-extending portion forming the terminal. The first terminal-extending portion, exposed from the sealing resin, extends in a first direction crossing the thickness direction. The first terminal-extending portion includes a first end facing in the first direction and a first side wall facing in a second direction crossing the thickness and first directions. The first side wall has, in the first direction, a first side closer to the first end, a second side closer to the sealing resin, and a third side between the first side and the second side. The metal layer, covering the first end, the first side and the second side, is provided at a location avoiding the third side.
Bibliography:Application Number: US202418652315