METHOD FOR PREPARING SHIELDED GATE SEMICONDUCTOR DEVICE STRUCTURE, AND SHIELDED GATE SEMICONDUCTOR DEVICE STRUCTURE

A method for preparing a shielded gate semiconductor device structure, and a shielded gate semiconductor device structure. The following steps are added in between source polycrystalline silicon deposition and gate polycrystalline silicon oxidation: removing, by etching, a first oxide layer and a se...

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Main Authors HE, Zengyi, YUAN, Qingwen, ZHANG, Libo, WU, Xingmin, LE, Shuangshen
Format Patent
LanguageEnglish
Published 15.08.2024
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Abstract A method for preparing a shielded gate semiconductor device structure, and a shielded gate semiconductor device structure. The following steps are added in between source polycrystalline silicon deposition and gate polycrystalline silicon oxidation: removing, by etching, a first oxide layer and a second oxide layer that are in a middle upper space of a cell trench and on the surface of a semiconductor material layer, and a portion of the semiconductor material layer between trenches; removing, by etching, the gate polycrystalline silicon until a thickness of remaining gate polycrystalline silicon in the source lead-out region trench reaches a preset thickness; and selectively removing, by etching, remaining gate polycrystalline silicon in the source lead-out region trench until no gate polycrystalline silicon remains in the source lead-out region trench, and then removing the photoresist.
AbstractList A method for preparing a shielded gate semiconductor device structure, and a shielded gate semiconductor device structure. The following steps are added in between source polycrystalline silicon deposition and gate polycrystalline silicon oxidation: removing, by etching, a first oxide layer and a second oxide layer that are in a middle upper space of a cell trench and on the surface of a semiconductor material layer, and a portion of the semiconductor material layer between trenches; removing, by etching, the gate polycrystalline silicon until a thickness of remaining gate polycrystalline silicon in the source lead-out region trench reaches a preset thickness; and selectively removing, by etching, remaining gate polycrystalline silicon in the source lead-out region trench until no gate polycrystalline silicon remains in the source lead-out region trench, and then removing the photoresist.
Author LE, Shuangshen
WU, Xingmin
YUAN, Qingwen
ZHANG, Libo
HE, Zengyi
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Snippet A method for preparing a shielded gate semiconductor device structure, and a shielded gate semiconductor device structure. The following steps are added in...
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SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title METHOD FOR PREPARING SHIELDED GATE SEMICONDUCTOR DEVICE STRUCTURE, AND SHIELDED GATE SEMICONDUCTOR DEVICE STRUCTURE
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