SEMICONDUCTOR MODULE

A semiconductor module includes a semiconductor element, a heat dissipation member thermally connected to the semiconductor element, a resin member, a signal terminal, and a wiring member. The resin member accommodates the semiconductor element, the heat dissipation member, and the wiring member. At...

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Bibliographic Details
Main Authors KUSAMA, HIROTOSHI, INOUE, NARUHIRO, ARAI, SHUNSUKE, MIWA, RYOTA, OMAE, SHOICHIRO, FUKUTANI, KEITA, FURUKAWA, YASUSHI, KATO, TAKAHIDE, NAGAI, SHUNA
Format Patent
LanguageEnglish
Published 15.08.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor module includes a semiconductor element, a heat dissipation member thermally connected to the semiconductor element, a resin member, a signal terminal, and a wiring member. The resin member accommodates the semiconductor element, the heat dissipation member, and the wiring member. At least a part of the heat dissipation member is exposed from the resin member. The wiring member is a member more flexible than the signal terminal, and includes an electrically insulating resin layer and a metal layer supported by the resin layer. The wiring member connects a signal pad of the semiconductor element and the signal terminal.
Bibliography:Application Number: US202418631633