JET IMPINGEMENT HEATSINK FOR HIGH POWER SEMICONDUCTOR DEVICES

A jet impingement cooling assembly for semiconductor devices may include a heat exchange base having an inlet chamber and an outlet chamber, an inlet connection in fluid connection with the inlet chamber, and an outlet connection in fluid connection with the outlet chamber. A plurality of jet nozzle...

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Bibliographic Details
Main Authors YUN, Changsun, JEON, Oseob
Format Patent
LanguageEnglish
Published 15.08.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A jet impingement cooling assembly for semiconductor devices may include a heat exchange base having an inlet chamber and an outlet chamber, an inlet connection in fluid connection with the inlet chamber, and an outlet connection in fluid connection with the outlet chamber. A plurality of jet nozzles may be attached to a semiconductor module, with the plurality of jet nozzles including corresponding openings positioned to cause jet impingement of fluid flow from the inlet chamber onto the semiconductor module and then into the outlet chamber.
Bibliography:Application Number: US202318167929