POWER OVERLAY PACKAGE FOR A SEMICONDUCTOR DEVICE

A semiconductor assembly includes a semiconductor device and a POL-RDL package coupled to said device. The device includes an upper surface, a gate pad and at least one source pad disposed on said upper surface. The POL-RDL package includes a dielectric layer having at least one source pad electrica...

Full description

Saved in:
Bibliographic Details
Main Authors Stevanovic, Ljubisa D, Gowda, Arun Virupaksha, Kapusta, Christopher James, Tuominen, Risto Ilkka Sakari, Gossman, Robert Dwayne
Format Patent
LanguageEnglish
Published 08.08.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A semiconductor assembly includes a semiconductor device and a POL-RDL package coupled to said device. The device includes an upper surface, a gate pad and at least one source pad disposed on said upper surface. The POL-RDL package includes a dielectric layer having at least one source pad electrically coupled to said at least one source pad of said device and at least one contact pad disposed. At least one trace connection having a resistivity value electrically couples said at least one source pad of said POL-RDL package to said at least one contact pad.
Bibliography:Application Number: US202318166192