TRANSISTOR DEVICE HAVING A GATE SETBACK FROM A GATE DIELECTRIC

An integrated chip including a first source/drain region and a second source/drain region in a semiconductor substrate and laterally spaced apart along a top surface of the substrate. A gate dielectric layer is over the substrate and extends laterally between the first source/drain region and the se...

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Bibliographic Details
Main Authors Jong, Yu-Chang, Liu, Ruey-Hsin, Chen, Fei-Yun, Kung, Ta-Yuan, Yao, Chih-Wen Albert, Chu, Chen-Liang, Lei, Ming-Ta
Format Patent
LanguageEnglish
Published 01.08.2024
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Summary:An integrated chip including a first source/drain region and a second source/drain region in a semiconductor substrate and laterally spaced apart along a top surface of the substrate. A gate dielectric layer is over the substrate and extends laterally between the first source/drain region and the second source/drain region. A thickness of the gate dielectric layer along a first sidewall of the gate dielectric layer is less than an average thickness of the gate dielectric layer. A trench isolation layer extends along gate dielectric layer. A first sidewall of the trench isolation layer extends along the first sidewall of the gate dielectric layer. A gate layer is directly over the gate dielectric layer and between the first source/drain region and the second source/drain region. A first sidewall of the gate layer is directly over the gate dielectric layer and laterally setback from the first sidewall of the gate dielectric layer.
Bibliography:Application Number: US202318162854