SEMICONDUCTOR PACKAGE

• Main Authors: LEE, Cheol-Woo, BAEK, Joonghyun, KANG, Hyungu, IM, Eunjeong, YOON, Sunghwan
• Format: Patent
• Language: English
• Published: 25.07.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor package including first and second chip stacks each including semiconductor chips having an offset stack structure, the second chip stack horizontally spaced apart from the first chip stack, a first buffer chip on the substrate and at a side of the first chip stack, a second buffer c...