METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Method of manufacturing semiconductor device, includes forming protective layer over substrate having plurality of protrusions and recesses. The protective layer includes polymer composition including polymer having repeating units of one or more of:Wherein a, b, c, d, e, f, g, h, and i are each ind...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
25.07.2024
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Subjects | |
Online Access | Get full text |
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