Electroplating Device

An electroplating device includes an electroplating pool containing an electroplating solution, a first anode plate immersed in the electroplating solution, and a first pulse rectifier having a positive electrode electrically connected to the first anode plate and a negative electrode electrically c...

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Main Authors Huang, Zhongxi, Zhang, Daiqiong (Diana), Zhu, Xunwei (Will), Nie, Jianhua, Zhou, Chunyan (Cherie), Peng, Dongqing (Gates), Yuan, Kefang, Deng, Zhongpu (Johnson)
Format Patent
LanguageEnglish
Published 18.07.2024
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:An electroplating device includes an electroplating pool containing an electroplating solution, a first anode plate immersed in the electroplating solution, and a first pulse rectifier having a positive electrode electrically connected to the first anode plate and a negative electrode electrically connected to a workpiece to be electroplated that is immersed in the electroplating solution. The first pulse rectifier periodically outputs a first set of pulse currents during electroplating of the workpiece. The first set of pulse currents includes a plurality of first different pulse currents that differ in a peak current density and a duty cycle.
Bibliography:Application Number: US202418414550