COOLING SYSTEM FOR POWER ELECTRONICS

A cooling system for cooling one or more heat-generating devices includes a heat sink to which the one or more heat-generating devices are thermally coupled and a heat exchanger thermally coupled to the heat sink. The heat exchanger has a first flow path for receiving a primary cooling fluid and a s...

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Bibliographic Details
Main Authors Joardar, Arindom, Sienel, Tobias
Format Patent
LanguageEnglish
Published 11.07.2024
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A cooling system for cooling one or more heat-generating devices includes a heat sink to which the one or more heat-generating devices are thermally coupled and a heat exchanger thermally coupled to the heat sink. The heat exchanger has a first flow path for receiving a primary cooling fluid and a second flow path for receiving a secondary cooling fluid. Heat is transferable to the primary cooling fluid from both the heat sink and the secondary cooling fluid at the heat exchanger.
Bibliography:Application Number: US202418405259