SEMICONDUCTOR PACKAGE

A semiconductor package may include a first package including a first substrate, a first semiconductor chip mounted on the first substrate, and a second substrate on the first semiconductor chip, the first package having a center region, a first edge region surrounding the center region, and a secon...

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Bibliographic Details
Main Authors KIM, TAEHWAN, RYU, Seunggeol, LEE, SHLE-GE
Format Patent
LanguageEnglish
Published 04.07.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package may include a first package including a first substrate, a first semiconductor chip mounted on the first substrate, and a second substrate on the first semiconductor chip, the first package having a center region, a first edge region surrounding the center region, and a second edge region surrounding the first edge region in a plan view, dummy balls disposed on the center region and the second edge region of the first package, connection terminals disposed on the first edge region of the first package, and a second package including a third substrate disposed on the dummy balls and the connection terminals and a second semiconductor chip mounted on the third substrate. The dummy balls may be in contact with the second substrate and may be spaced apart from the third substrate, and the connection terminals may be coupled to the second and third substrates.
Bibliography:Application Number: US202318238099