RELEASE FILM FOR SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING THE SAME

• Main Authors: Yoon, Goan-Hee, Lee, Jeong-Eun
• Format: Patent
• Language: English
• Published: 04.07.2024
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING-UP

Release films for a semiconductor package, manufacturing methods thereof and manufacturing methods of a semiconductor package using the same are disclosed. A release film for a semiconductor package may include an intermediate body layer including a structure in which at least one polyurethane layer and at least one antistatic layer are laminated, a first release layer disposed on a lower surface of the intermediate body layer and having a first fine unevenness for releasability on a lower surface portion, and a second release layer disposed on an upper surface of the intermediate body layer and having a second fine unevenness for releasability on an upper surface portion. The at least one polyurethane layer may include thermosetting polyurethane having a cross-linkage.