METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT

A method of manufacturing a semiconductor element includes: providing a structure including: a semiconductor structure, a resin member, and a first insulation film;forming a cover member disposed continuously on a portion of the first insulation film; forming a resist film on the cover member, and r...

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Bibliographic Details
Main Authors ISHITANI, Takehiro, KAWAGUCHI, Hirofumi
Format Patent
LanguageEnglish
Published 27.06.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of manufacturing a semiconductor element includes: providing a structure including: a semiconductor structure, a resin member, and a first insulation film;forming a cover member disposed continuously on a portion of the first insulation film; forming a resist film on the cover member, and removing a portion of the cover member; removing a portion of the first insulation film and a portion of the resin member; and removing a remaining portion of the cover member.
Bibliography:Application Number: US202318536945