SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

A semiconductor device and a method for manufacturing the same is provided. The semiconductor device includes a power delivery network layer; an insulating layer on the power delivery network layer and having an opening therein; a semiconductor layer filling the opening and covering the insulating l...

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Main Authors KIM, Guk Hee, NA, Sang Cheol, KIM, Young Woo, KIM, Jin Kyu, LEE, Anthony Dongick, GWAK, Min Chan, LEE, Kyoung Woo, NAM, Yun Suk, FUKUTOME, Hidenobu
Format Patent
LanguageEnglish
Published 20.06.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device and a method for manufacturing the same is provided. The semiconductor device includes a power delivery network layer; an insulating layer on the power delivery network layer and having an opening therein; a semiconductor layer filling the opening and covering the insulating layer; a first through-via extending through the semiconductor layer and electrically connected to the power delivery network layer; a second through-via extending through the insulating layer and the semiconductor layer and electrically connected to the power delivery network layer; a logic element on the semiconductor layer and electrically connected to the first through-via; and a passive element on the semiconductor layer and electrically connected to the second through-via.
Bibliography:Application Number: US202318486416