THERMALLY CONDUCTIVE BOARD

• Main Author: LO, KUOANG
• Format: Patent
• Language: English
• Published: 20.06.2024
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

A thermally conductive board includes a top metal foil, a bottom metal foil, and a thermally conductive layer laminated therebetween. The thermally conductive layer includes an electrically insulation matrix and a thermally conductive filler. The electrically insulation matrix includes a fluoropolymer. The thermally conductive filler includes a glass fiber dispersed in the electrically insulation matrix. The glass fiber has a first dielectric constituent and a second dielectric constituent. The first dielectric constituent is a halogen. The total weight of the glass fiber is calculated as 100%, and the halogen accounts for at least 0.05%. The second dielectric constituent is a titanium family element. The total weight of the glass fiber is calculated as 100%, and the titanium family element accounts for at least 0.03%.