CURABLE PRECURSOR OF AN ADHESIVE COMPOSITION

The present disclosure relates to a curable precursor of an adhesive composition. the curable precursor comprising a first part and a second part, wherein the first part comprises: (a) a radically (co) polymerizable (meth) acrylate-based component comprising (i) C1C32 (meth) acrylic acid ester monom...

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Bibliographic Details
Main Authors Kropp, Michael A, Shaaban, Ahmad, Lin, Binhong, Sprott, Sascha, Tong, Ling Jie, Jung, Adrian T
Format Patent
LanguageEnglish
Published 20.06.2024
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Summary:The present disclosure relates to a curable precursor of an adhesive composition. the curable precursor comprising a first part and a second part, wherein the first part comprises: (a) a radically (co) polymerizable (meth) acrylate-based component comprising (i) C1C32 (meth) acrylic acid ester monomers; and wherein the second part comprises (b) an initiator; and (c) a vinyl aromatic compound. The present disclosure further relates to a process for making a cured composition from said curable precursor and to the use of said curable precursor for adhesive applications and/or for thermal management applications in the automotive industry.
Bibliography:Application Number: US202118553853