PRINTED CIRCUIT BOARD

A printed circuit board includes: a first metal layer; an organic insulating layer covering at least a portion of the first metal layer and having a via hole exposing at least a portion of an upper surface of the first metal layer; a first seed metal layer disposed on an upper surface of the organic...

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Bibliographic Details
Main Authors CHO, Sangik, HAN, Sung, PARK, Jong Eun, KIM, Mi Geum, PARK, Mi Jung, LEE, Yong Su
Format Patent
LanguageEnglish
Published 13.06.2024
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A printed circuit board includes: a first metal layer; an organic insulating layer covering at least a portion of the first metal layer and having a via hole exposing at least a portion of an upper surface of the first metal layer; a first seed metal layer disposed on an upper surface of the organic insulating layer; a second seed metal layer disposed on the first seed metal layer and extending onto a wall surface of the via hole and the exposed upper surface of the first metal layer; and a second metal layer disposed on the second seed metal layer and filling at least a portion of the via hole, wherein the first seed metal layer includes a first sputtering layer including titanium (Ti), and the second seed metal layer includes an electroless plating layer.
Bibliography:Application Number: US202318138893