METHOD FOR PRODUCING A COMPONENT HAVING A CAVITY, AND COMPONENT HAVING A CAVITY

A component includes a carrier, at least one semiconductor chip, an intermediate layer and a cover layer. The semiconductor chip, the intermediate layer and the cover layer are arranged on the carrier. The cover layer has at least one cavity wherein the semiconductor chip is arranged. The intermedia...

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Bibliographic Details
Main Author HÖPPEL, Lutz
Format Patent
LanguageEnglish
Published 06.06.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A component includes a carrier, at least one semiconductor chip, an intermediate layer and a cover layer. The semiconductor chip, the intermediate layer and the cover layer are arranged on the carrier. The cover layer has at least one cavity wherein the semiconductor chip is arranged. The intermediate layer is electrically insulating and is arranged in regions along the vertical direction between the carrier and the cover layer. The intermediate layer extends along lateral direction into the cavity and adjoins the semiconductor chip. The cover layer has a vertical height that varies depending on the lateral positions of the cover layer and has a reduced vertical height at the positions of the intermediate layer.
Bibliography:Application Number: US202218287727