TRANSFER MODULE AND TRANSFER METHOD

The present disclosure provides a transfer module, comprising: a first transfer chamber; a second transfer chamber, the second transfer chamber capable of accommodating a container accommodating a plurality of objects; and an opening/closing door configured to partition the first transfer chamber an...

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Bibliographic Details
Main Authors KITA, Masatomo, TOYOMAKI, Toshiaki, AMIKURA, Norihiko, KAISE, Seiichi, SAEGUSA, Makoto
Format Patent
LanguageEnglish
Published 06.06.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present disclosure provides a transfer module, comprising: a first transfer chamber; a second transfer chamber, the second transfer chamber capable of accommodating a container accommodating a plurality of objects; and an opening/closing door configured to partition the first transfer chamber and the second transfer chamber, wherein the first transfer chamber has an accommodation portion configured to accommodate the object to be carried into the second transfer chamber, and the container accommodating the plurality of objects is carried into the second transfer chamber, the plurality of objects are transferred from the container to the accommodation portion in the first transfer chamber, the object is transferred from the accommodation portion into the vacuum transfer module, and the object carried out from the vacuum transfer module is transferred into the container without passing through the accommodation portion.
Bibliography:Application Number: US202318525930