CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF

A coreless substrate package includes a coreless substrate; a package device mounted on a coreless substrate; an underfill material filling into a space between the package device and the coreless substrate; a stiffener ring disposed on a top surface of the coreless substrate along perimeter of the...

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Bibliographic Details
Main Authors Tsao, Pei-Haw, Wong, Te-Chi
Format Patent
LanguageEnglish
Published 30.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A coreless substrate package includes a coreless substrate; a package device mounted on a coreless substrate; an underfill material filling into a space between the package device and the coreless substrate; a stiffener ring disposed on a top surface of the coreless substrate along perimeter of the coreless substrate; and a gap fill material disposed in a gap between the stiffener ring and the package device.
Bibliography:Application Number: US202318502105