STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FORMING REPLACEMENT WORD LINES THROUGH MEMORY OPENINGS
A memory device includes an alternating stack of insulating layers and composite layers, where each of the composite layers contains an electrically conductive layer and a dielectric material plate, memory openings vertically extending through the alternating stack, memory opening fill structures lo...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
30.05.2024
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Subjects | |
Online Access | Get full text |
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Summary: | A memory device includes an alternating stack of insulating layers and composite layers, where each of the composite layers contains an electrically conductive layer and a dielectric material plate, memory openings vertically extending through the alternating stack, memory opening fill structures located in the memory openings, where each of the memory opening fill structures includes a respective vertical stack of memory elements and a vertical semiconductor channel and a plurality of integrated line-and-via structures. Each of the plurality of integrated line-and-via structures includes a conductive plate portion that contacts the electrically conductive layer of a respective one of the composite layers, and a conductive via portion that is adjoined to a top surface of the conductive plate portion and vertically extends through a respective overlying subset of the insulating layers and a subset of the dielectric material plates of the composite layers. |
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Bibliography: | Application Number: US202318349578 |