GLASS MATERIAL

The present invention provides a glass material that has a suitable thermal expansion coefficient to meet the application in the field of semiconductor manufacturing. A glass material, wherein components thereof are represented by weight percentage, comprising: 43-63% of SiO2; 0-15% of B2O3; 2-15% o...

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Bibliographic Details
Main Authors KUANG, Bo, HAO, Liangzhen, MAO, Lulu
Format Patent
LanguageEnglish
Published 30.05.2024
Subjects
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS
CHEMISTRY
GLASS
JOINING GLASS TO GLASS OR OTHER MATERIALS
METALLURGY
MINERAL OR SLAG WOOL
SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS
SURFACE TREATMENT OF GLASS
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Summary:The present invention provides a glass material that has a suitable thermal expansion coefficient to meet the application in the field of semiconductor manufacturing. A glass material, wherein components thereof are represented by weight percentage, comprising: 43-63% of SiO2; 0-15% of B2O3; 2-15% of Al2O3; 11-30% of BaO; 3-18% of CaO. Through rational component design, the glass material of the present invention has a suitable thermal expansion coefficient and is applicable to the field of semiconductor manufacturing.
Bibliography:Application Number: US202318384929