IMAGE SENSOR MODULE

An image sensor module having an image sensor chip configured to convert light collected from an outside into an electric signal, a substrate on which the image sensor chip is installed, a bonding wire electrically connecting the image sensor chip and the substrate, an encapsulant for encapsulating...

Full description

Saved in:
Bibliographic Details
Main Authors CHU, Kyungsung, SONG, In-Sang
Format Patent
LanguageEnglish
Published 23.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:An image sensor module having an image sensor chip configured to convert light collected from an outside into an electric signal, a substrate on which the image sensor chip is installed, a bonding wire electrically connecting the image sensor chip and the substrate, an encapsulant for encapsulating the bonding wire by surrounding the side part of the image sensor chip, and a housing having a lower part spaced apart from the encapsulant and bonded on the substrate, and an upper part having an opening through which an external light is incident to the image sensor chip and supported by the encapsulant.
Bibliography:Application Number: US202318220394