Silicon Etching Solution, Method for Treating Substrate, and Method for Manufacturing Silicon Device

In etching of a single crystal silicon substrate having a Si crystal plane ((100) plane, (110) plane, and (111) plane) as a main plane, an etching rate on the (110) plane cannot be sufficiently reduced, and there is room for improvement in an etching rate ratio between the (110) plane and the (111)...

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Bibliographic Details
Main Authors Hitomi, Tatsuya, Okimura, Kohshiro, Seike, Yoshiki, Noro, Kohsuke
Format Patent
LanguageEnglish
Published 23.05.2024
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