CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

A display apparatus includes a silicon substrate including a first surface and a second surface opposite thereto and including an opaque material, a display panel disposed on the first surface of the silicon substrate, a base film including a third surface and a fourth surface opposite thereto, the...

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Bibliographic Details
Main Authors CHUNG, Yechung, KIM, Woonbae, HA, Jeongkyu
Format Patent
LanguageEnglish
Published 16.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A display apparatus includes a silicon substrate including a first surface and a second surface opposite thereto and including an opaque material, a display panel disposed on the first surface of the silicon substrate, a base film including a third surface and a fourth surface opposite thereto, the fourth surface having a portion facing the first surface of the silicon substrate, a display driving chip mounted on the base film, a connector disposed on a portion of the third surface of the base film, and a driving printed circuit board (PCB) electrically connected with the base film, wherein the silicon substrate corresponds to the base film in a one-to-one relationship, and a length of an edge of the base film overlapping the silicon substrate is about 90% of a length of an edge of the silicon substrate parallel to the edge of the base film.
Bibliography:Application Number: US202318376467