POLISHING PAD AND METHOD FOR PRODUCING POLISHED PRODUCT

A polishing pad including a polyurethane sheet as a polishing layer, wherein the polyurethane sheet has a ratio (E′B40/E′T40) of a storage elastic modulus E′B40 at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a frequency of 1.6 Hz to a storage elastic m...

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Bibliographic Details
Main Authors TATENO, Teppei, TAKAMIZAWA, Yamato, MATSUOKA, Ryuma, YAMAGUCHI, Satsuki, KURIHARA, Hiroshi
Format Patent
LanguageEnglish
Published 09.05.2024
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GENERAL PROCESSES OF COMPOUNDING
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
POLISHING
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
WORKING-UP
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Summary:A polishing pad including a polyurethane sheet as a polishing layer, wherein the polyurethane sheet has a ratio (E′B40/E′T40) of a storage elastic modulus E′B40 at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a frequency of 1.6 Hz to a storage elastic modulus E′T40 at 40° C. in dynamic viscoelasticity measurement performed under a tension mode condition with a frequency of 1.6 Hz of 0.60 to 1.60.
Bibliography:Application Number: US202118282165