VERTICAL LED CHIP STRUCTURE, METHOD OF MANUFACTURING SAME AND LIGHT-EMITTING DEVICE

A vertical LED chip structure, a method of manufacturing the same, and a light-emitting device are provided. After an epitaxial structure is bonded to a substrate, the epitaxial structure is etched first to form a first mesa. After the first mesa is formed, the epitaxial structure is continuously et...

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Bibliographic Details
Main Authors BAI, Xiao, HU, Pengjie, LIU, Shengnan, LIU, Jiayu, KE, Weifan
Format Patent
LanguageEnglish
Published 02.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A vertical LED chip structure, a method of manufacturing the same, and a light-emitting device are provided. After an epitaxial structure is bonded to a substrate, the epitaxial structure is etched first to form a first mesa. After the first mesa is formed, the epitaxial structure is continuously etched at the first mesa until the epitaxial structure is etched through and a reflective layer is exposed, and a second mesa is formed. A protective layer is formed on a surface of the structure where the first mesa and the second mesa are formed. The protective layer covers the exposed reflective layer at the second mesa, protects the epitaxial structure and the reflective layer, and protects a side wall of the epitaxial structure and the reflective layer from being corroded by a processing solution after a back surface of the substrate is polished.
Bibliography:Application Number: US202318476227