INTEGRATED CIRCUIT STRUCTURES HAVING GERMANIUM-BASED CHANNELS

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, integrated circuit structures having germanium-based channels are described. In an example, an integrated circuit structure includes a fin having a lower silicon portion, an interm...

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Main Authors CHOUKSEY, Siddharth, KENNEL, Harold, AGRAWAL, Ashish, SUNG, Seung Hoon, KAVALIEROS, Jack T, GLASS, Glenn, MURTHY, Anand, GHANI, Tahir
Format Patent
LanguageEnglish
Published 02.05.2024
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Abstract Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, integrated circuit structures having germanium-based channels are described. In an example, an integrated circuit structure includes a fin having a lower silicon portion, an intermediate germanium portion on the lower silicon portion, and a silicon germanium portion on the intermediate germanium portion. An isolation structure is along sidewalls of the lower silicon portion of the fin. A gate stack is over a top of and along sidewalls of an upper portion of the fin and on a top surface of the isolation structure. A first source or drain structure is at a first side of the gate stack. A second source or drain structure is at a second side of the gate stack.
AbstractList Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, integrated circuit structures having germanium-based channels are described. In an example, an integrated circuit structure includes a fin having a lower silicon portion, an intermediate germanium portion on the lower silicon portion, and a silicon germanium portion on the intermediate germanium portion. An isolation structure is along sidewalls of the lower silicon portion of the fin. A gate stack is over a top of and along sidewalls of an upper portion of the fin and on a top surface of the isolation structure. A first source or drain structure is at a first side of the gate stack. A second source or drain structure is at a second side of the gate stack.
Author MURTHY, Anand
GHANI, Tahir
SUNG, Seung Hoon
GLASS, Glenn
KENNEL, Harold
KAVALIEROS, Jack T
CHOUKSEY, Siddharth
AGRAWAL, Ashish
Author_xml – fullname: CHOUKSEY, Siddharth
– fullname: KENNEL, Harold
– fullname: AGRAWAL, Ashish
– fullname: SUNG, Seung Hoon
– fullname: KAVALIEROS, Jack T
– fullname: GLASS, Glenn
– fullname: MURTHY, Anand
– fullname: GHANI, Tahir
BookMark eNrjYmDJy89L5WSw9fQLcXUPcgxxdVFw9gxyDvUMUQgOCQp1DgkNcg1W8HAM8_RzV3B3DfJ19PMM9dV1cgwGqfRw9PNz9QnmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkYmhiampiaWjobGxKkCABQ8LNY
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2024145549A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2024145549A13
IEDL.DBID EVB
IngestDate Fri Jul 19 13:06:11 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2024145549A13
Notes Application Number: US202418409509
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240502&DB=EPODOC&CC=US&NR=2024145549A1
ParticipantIDs epo_espacenet_US2024145549A1
PublicationCentury 2000
PublicationDate 20240502
PublicationDateYYYYMMDD 2024-05-02
PublicationDate_xml – month: 05
  year: 2024
  text: 20240502
  day: 02
PublicationDecade 2020
PublicationYear 2024
RelatedCompanies Intel Corporation
RelatedCompanies_xml – name: Intel Corporation
Score 3.5438426
Snippet Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, integrated circuit structures having...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title INTEGRATED CIRCUIT STRUCTURES HAVING GERMANIUM-BASED CHANNELS
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240502&DB=EPODOC&locale=&CC=US&NR=2024145549A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFPVNp-LHlILSt-I-2q19KNKmn2K70bRjb6NJWxCkG67iv28SOt3T3pJcOJLA3eWSu98BPGs0H5JcpQrRpxxUm-aKblRjpcinQzoxdEo0nuAcxZMgU9-W2rIDn7tcGIET-iPAEZlEUSbvjdDXm_9HLEfEVm5fyAcbWr96qenIrXfMzJM2GMmObbrzmTNDMkJmhuU4ETSOya0aFvOVjvhFmiPtuwub56Vs9o2Kdw7Hc8avbi6gU9Y9OEW72ms9OInaL2_WbKVvewkCv9ZPLKZsJBQmKAtTCadJhnjoApYCaxHGvuS7SWTFYRYptoX5zMCKY_cdX8GT56YoUNg6Vn_bXmV4f9Hja-jW67q8AanKqcb0FKGkrNScV-0sxgPKhLHSSWFQ9Rb6hzjdHSbfwxnviqC-UR-6zdd3-cAMb0MexXn9AqKwgfI
link.rule.ids 230,309,786,891,25594,76903
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFOebTsWPqQWlb8V9tFv7MKRLu7W6ZqMfY2-jyVoQpBuu4r_vJWy6p72FXDiSwO-OS-5-B_Bs8LTFUp1rzOwJUm2eaqaVd7Rl2mvxrmVyZogC54B2vUR_mxvzCnzuamEkT-iPJEdERHHEeynt9fr_EcuRuZWbF_aBU6vXYdx31G10jO7JaLZVZ9B3pxNnQlRC-kmk0lDKBCe3btkYKx31MCiUwdJsIOpS1vtOZXgGx1PUV5TnUMmKOtTIrvdaHU6C7Zc3Drfo21yA5K8dhTYaG4X4IUn8WIniMCEidSFSPHvm05EycsPApn4SaAM7Eis9m1J3HF3C09CNiafhPhZ_x14k0f6mO1dQLVZFdg1KnnID7RTjLMv1VHTtXHaaHMGYm2xpcf0GGoc03R4WP0LNi4PxYuzT9zs4FSKZ4NduQLX8-s7u0QmX7EHe3S_bSoTc
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=INTEGRATED+CIRCUIT+STRUCTURES+HAVING+GERMANIUM-BASED+CHANNELS&rft.inventor=CHOUKSEY%2C+Siddharth&rft.inventor=KENNEL%2C+Harold&rft.inventor=AGRAWAL%2C+Ashish&rft.inventor=SUNG%2C+Seung+Hoon&rft.inventor=KAVALIEROS%2C+Jack+T&rft.inventor=GLASS%2C+Glenn&rft.inventor=MURTHY%2C+Anand&rft.inventor=GHANI%2C+Tahir&rft.date=2024-05-02&rft.externalDBID=A1&rft.externalDocID=US2024145549A1