LEAD FRAME AND MANUFACTURING METHOD THEREOF

A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 1...

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Main Authors YAMADA, Masahiro, SEKI, Kentarou, SHINOZAKI, Kazuhiro, NAGATA, Masahiro, OKUYAMA, Daisuke, OOUCHI, Kazunori, MATSUI, Hideto, HATSUTA, Chiaki
Format Patent
LanguageEnglish
Published 02.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.
AbstractList A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.
Author SEKI, Kentarou
SHINOZAKI, Kazuhiro
OKUYAMA, Daisuke
OOUCHI, Kazunori
MATSUI, Hideto
HATSUTA, Chiaki
NAGATA, Masahiro
YAMADA, Masahiro
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– fullname: SHINOZAKI, Kazuhiro
– fullname: NAGATA, Masahiro
– fullname: OKUYAMA, Daisuke
– fullname: OOUCHI, Kazunori
– fullname: MATSUI, Hideto
– fullname: HATSUTA, Chiaki
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Snippet A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title LEAD FRAME AND MANUFACTURING METHOD THEREOF
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