LEAD FRAME AND MANUFACTURING METHOD THEREOF

A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 1...

Full description

Saved in:
Bibliographic Details
Main Authors YAMADA, Masahiro, SEKI, Kentarou, SHINOZAKI, Kazuhiro, NAGATA, Masahiro, OKUYAMA, Daisuke, OOUCHI, Kazunori, MATSUI, Hideto, HATSUTA, Chiaki
Format Patent
LanguageEnglish
Published 02.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.
Bibliography:Application Number: US202218279608