Block Copolymer Composition And Methods Of Preparation Thereof

The disclosure relates to a styrenic block copolymer (SBC) having at least a triblock, and a diblock structure with a diblock content of up to 50 wt. %. The SBC is suitable for film applications requiring soft stretch properties even without adding oil, pressure sensitive adhesive applications, phot...

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Bibliographic Details
Main Authors Maris, Catherine A. L, Muyldermans, Xavier D.D.J, Dupont, Martine
Format Patent
LanguageEnglish
Published 02.05.2024
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
WORKING-UP
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Summary:The disclosure relates to a styrenic block copolymer (SBC) having at least a triblock, and a diblock structure with a diblock content of up to 50 wt. %. The SBC is suitable for film applications requiring soft stretch properties even without adding oil, pressure sensitive adhesive applications, photocurable (photopolymerizable) printing plates, etc. Additional components can be added to the SBC, accordingly, forming the end-use (application) composition.
Bibliography:Application Number: US202318471386