CONTROL OF CARRIER HEAD SWEEP AND PLATEN SHAPE

• Main Authors: Oh, Jeonghoon, Lischka, David J, Lee, Christopher Heung-Gyun, Gurusamy, Jay, Zuniga, Steven M, Cheung, Ghunbong, Zhang, Huanbo, Mikhaylichenko, Ekaterina A
• Format: Patent
• Language: English
• Published: 02.05.2024
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

A controller of a chemical mechanical polishing system is configured to cause a carrier head to sweep across a polishing pad in accord with a sweep profile. The controller is also configured to select values for a plurality of control parameters to minimize a difference between a target removal profile and an expected removal profile. The plurality of control parameters include a plurality of dwell time parameters. A relationship between the plurality of control parameters and a removal rate is stored in a data structure representing a first matrix which includes a plurality of columns including a column for each dwell time parameter and a row for each position on the substrate represented in the expected removal profile, and the controller is configured to, as part of selection of the values, calculate the expected removal profile by multiplying the first matrix by a second matrix representing control parameter values.