ELECTRONIC PACKAGE

An electronic package is provided, in which a first electronic module and a second electronic module are stacked via a plurality of first conductive structures and a plurality of second conductive structures, and the amount of solder of the first conductive structures is greater than the amount of s...

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Bibliographic Details
Main Authors CHIANG, Men-Yeh, WANG, Hung-Kai, HUANG, Yu-Lung, JIANG, Yih-Jenn, JIANG, Don-Son
Format Patent
LanguageEnglish
Published 25.04.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic package is provided, in which a first electronic module and a second electronic module are stacked via a plurality of first conductive structures and a plurality of second conductive structures, and the amount of solder of the first conductive structures is greater than the amount of solder of the second conductive structures, such that the electronic package can be configured with the first conductive structures and the second conductive structures according to the degree of warpage of the electronic package, so as to effectively disperse the stress to avoid the problem of warpage.
Bibliography:Application Number: US202218064404