SCALING FOR DIE-LAST ADVANCED IC PACKAGING

• Main Authors: KANG, Chung-Shin, CHEN, Jang Fung, SHEN, Wei-Ning, LAIDIG, Thomas L, TSAI, Chi-Ming
• Format: Patent
• Language: English
• Published: 18.04.2024
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

Embodiments of the present disclosure relate to a system, a software application, and methods of digital lithography for semiconductor packaging. The method includes comparing positions of vias and via locations, generating position data based on the comparing the positions of vias and the via locat...