CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure...

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Bibliographic Details
Main Authors HUANG, Cheng-Lin, CHU, Che-Jung, LI, Ling-Wei, WU, Yu-Jui, CHEN, Lieh-Chuan, LI, Chien-Chen, YANG, Sheng-Yao, LIU, Kuo-Chio
Format Patent
LanguageEnglish
Published 11.04.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.
Bibliography:Application Number: US202318543124