SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS

In some examples, a semiconductor package includes a semiconductor die; a conductive member coupled to the semiconductor die; and a multi-layer package substrate. The multi-layer package substrate includes a first horizontal metal layer to provide a ground connection; a second horizontal metal layer...

Full description

Saved in:
Bibliographic Details
Main Authors HERBSOMMER, Juan, MURUGAN, Rajen Manicon, TANG, Yiqi
Format Patent
LanguageEnglish
Published 04.04.2024
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:In some examples, a semiconductor package includes a semiconductor die; a conductive member coupled to the semiconductor die; and a multi-layer package substrate. The multi-layer package substrate includes a first horizontal metal layer to provide a ground connection; a second horizontal metal layer above the first horizontal metal layer; vertical members coupling to the first and second horizontal metal layers; and a mold compound covering the first and second horizontal metal layers and the vertical members. The first horizontal metal layer, the second horizontal metal layer, and the vertical members together form a structure including a conductive strip coupled to the conductive member, a transition member coupled to the conductive strip, a waveguide coupled to the transition member, and a horn antenna coupled to the waveguide.
Bibliography:Application Number: US202217956798