ACCURATE AND FAST POWER MODULE PROPERTIES ASSESSMENT

Systems and methods for accurate and fast measurement of junction temperature for power modules are provided. Such systems and methods include a one or more power transistors that each have a respective die surface over which is positioned and electrically coupled to a conductive overlay. A temperat...

Full description

Saved in:
Bibliographic Details
Main Authors Cho, Hyunmin, Yang, Liqiang, Grimes, Darrell L, Lee, Shung Ik
Format Patent
LanguageEnglish
Published 04.04.2024
Subjects
BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
GENERATION
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
Online AccessGet full text

Cover

More Information
Summary:Systems and methods for accurate and fast measurement of junction temperature for power modules are provided. Such systems and methods include a one or more power transistors that each have a respective die surface over which is positioned and electrically coupled to a conductive overlay. A temperature sensor is physically bonded to a top surface of the conductive overlay to provide a direct temperature measurement for the one or more power transistors.
Bibliography:Application Number: US202217957333