REPOSITIONING COOLING CHANNELS IN COOLING MOLDS

A three-dimensional computer model of a cooling mold for a part and a specification of an initial layout of one or more cooling channels integrated into the cooling mold is obtained. Data regarding temperatures of a cavity surface of the cooling mold in contact with the part is produced. Individual...

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Bibliographic Details
Main Authors Yu, Huagang, Astbury, David Ross, Markovic, Nikola Marko, Kietzmann, Clinton van Lingen, Bin Abu Bakar, Akmal Ariff
Format Patent
LanguageEnglish
Published 04.04.2024
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Summary:A three-dimensional computer model of a cooling mold for a part and a specification of an initial layout of one or more cooling channels integrated into the cooling mold is obtained. Data regarding temperatures of a cavity surface of the cooling mold in contact with the part is produced. Individual portions of the one or more cooling channels are moved toward hotter portions of the cavity surface, without moving any branch junctions of the one or more cooling channels and while keeping one or more diameters of the one or more cooling channels constant.
Bibliography:Application Number: US202217958145