Three-Dimensional Semiconductor Device and Method

Embodiments provide a method of performing a carrier switch for a device wafer, attaching a second wafer and removing a first wafer. A buffer layer is deposited over the device wafer, buffer layer reducing the topography of the surface of the device wafer. After the carrier switch a film-on-wire lay...

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Bibliographic Details
Main Authors Hou, Hao-Cheng, Wang, Tsung-Ding, Lee, Chien-Hsun, Wang, Jeng-An, Lin, Sheng-Chi
Format Patent
LanguageEnglish
Published 28.03.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments provide a method of performing a carrier switch for a device wafer, attaching a second wafer and removing a first wafer. A buffer layer is deposited over the device wafer, buffer layer reducing the topography of the surface of the device wafer. After the carrier switch a film-on-wire layer is removed from the buffer layer and then the buffer layer is at least in part removed.
Bibliography:Application Number: US202318152558