GOLD ELECTROPLATING SOLUTION
A cyanide-free gold electroplating solution for forming gold deposits contains bismuth and compact-packed via-filling deposit with a U-shaped stacked structure in cross section inside drilled holes. A gold electroplating solution includes 15 g/L of gold (I) sodium sulfite (as gold element), 15 g/L o...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English |
Published |
28.03.2024
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A cyanide-free gold electroplating solution for forming gold deposits contains bismuth and compact-packed via-filling deposit with a U-shaped stacked structure in cross section inside drilled holes. A gold electroplating solution includes 15 g/L of gold (I) sodium sulfite (as gold element), 15 g/L of sodium sulfate, 50 g/L of sodium sulfite, 10 mg/L of thallium formate (as thallium element), 50 mg/L of bismuth nitrate (as bismuth element) and 1 g/L of sodium phosphate. |
---|---|
Bibliography: | Application Number: US202318372302 |