PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE

A printed circuit board (PCB) assembly includes a first circuit board, an electronic component provided on the first circuit board, a second circuit board connected to the first circuit board, a thermal module configured to absorb heat from the electronic component, and a pressurizing structure conf...

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Bibliographic Details
Main Authors RHEE, Bongjae, KANG, Junghan, CHUNG, Haein, LIM, Jonghyun
Format Patent
LanguageEnglish
Published 21.03.2024
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Summary:A printed circuit board (PCB) assembly includes a first circuit board, an electronic component provided on the first circuit board, a second circuit board connected to the first circuit board, a thermal module configured to absorb heat from the electronic component, and a pressurizing structure configured to apply a pre-load to the thermal module in a direction toward the electronic component, where the pressurizing structure is separated from the second circuit board and is supported by the first circuit board or an external structure.
Bibliography:Application Number: US202318375156