PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE
A printed circuit board (PCB) assembly includes a first circuit board, an electronic component provided on the first circuit board, a second circuit board connected to the first circuit board, a thermal module configured to absorb heat from the electronic component, and a pressurizing structure conf...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
21.03.2024
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Subjects | |
Online Access | Get full text |
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Summary: | A printed circuit board (PCB) assembly includes a first circuit board, an electronic component provided on the first circuit board, a second circuit board connected to the first circuit board, a thermal module configured to absorb heat from the electronic component, and a pressurizing structure configured to apply a pre-load to the thermal module in a direction toward the electronic component, where the pressurizing structure is separated from the second circuit board and is supported by the first circuit board or an external structure. |
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Bibliography: | Application Number: US202318375156 |