ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
An electronic component embedded substrate includes: a core layer having a first through portion; an electronic component module including at least one electronic component and a metal layer surrounding at least a portion of the electronic component and disposed in the first penetration portion; and...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
14.03.2024
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Subjects | |
Online Access | Get full text |
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Summary: | An electronic component embedded substrate includes: a core layer having a first through portion; an electronic component module including at least one electronic component and a metal layer surrounding at least a portion of the electronic component and disposed in the first penetration portion; and a first encapsulant disposed on the core layer, disposed in at least a portion of the first through portion, and covering at least a portion of the electronic component module. |
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Bibliography: | Application Number: US202318513990 |