PATCH ACCOMMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES

Techniques for a patch to couple one or more surface dies to an interposer or motherboard are provided. In an example, the patch can include multiple embedded dies. In an example, a microelectronic device can be formed to include a patch on an interposer, where the patch can include multiple embedde...

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Bibliographic Details
Main Authors BOYAPATI, Sri Ranga Sai, TANAKA, Hiroki, MAY, Robert Alan, DARMAWIKARTA, Kristof, PIETAMBARAM, Srinivas, MANEPALLI, Rahul N
Format Patent
LanguageEnglish
Published 14.03.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Techniques for a patch to couple one or more surface dies to an interposer or motherboard are provided. In an example, the patch can include multiple embedded dies. In an example, a microelectronic device can be formed to include a patch on an interposer, where the patch can include multiple embedded dies and each die can have a different thickness.
Bibliography:Application Number: US202318511641