SEMICONDUCTOR PACKAGE

A semiconductor package may include a first redistribution structure, a first semiconductor chip on the first redistribution structure, a first molding layer covering the first semiconductor chip, first connection structures on the first redistribution structure and extending in a vertical direction...

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Bibliographic Details
Main Authors CHOI, Juil, OH, Sanghyuck, HEO, Hongseo, LEE, Jaeyoung, JUNG, Jaemok, PARK, Jongho
Format Patent
LanguageEnglish
Published 07.03.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package may include a first redistribution structure, a first semiconductor chip on the first redistribution structure, a first molding layer covering the first semiconductor chip, first connection structures on the first redistribution structure and extending in a vertical direction while passing through the first molding layer, a second redistribution structure on the first semiconductor chip, a second semiconductor chip on the second redistribution structure, and a metal layer on the second semiconductor chip. The metal layer may be in contact with an upper surface of the second semiconductor chip.
Bibliography:Application Number: US202318366054