DOUBLE-DECKED INTERCONNECT FEATURES

• Main Authors: Choi, June, Mehta, Nikhil J, Ong, Clifford L, Schenker, Richard, Wallace, Charles H
• Format: Patent
• Language: English
• Published: 29.02.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An integrated circuit structure includes a first interconnect layer, and a second interconnect layer above the first interconnect layer. The first interconnect layer includes a first interconnect feature and a second interconnect feature. The second interconnect layer includes a third interconnect f...