SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
A semiconductor device and method of fabricating the same include a substrate, a first epitaxial layer, a first protection layer, and a contact etching stop layer. The substrate includes a PMOS transistor region, and the first epitaxial layer is disposed on the substrate, within the PMOS transistor...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
29.02.2024
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor device and method of fabricating the same include a substrate, a first epitaxial layer, a first protection layer, and a contact etching stop layer. The substrate includes a PMOS transistor region, and the first epitaxial layer is disposed on the substrate, within the PMOS transistor region. The first protection layer is disposed on the first epitaxial layer, covering surfaces of the first epitaxial layer. The contact etching stop layer is disposed on the first protection layer and the substrate, wherein a portion of the first protection layer is exposed from the contact etching stop layer. |
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Bibliography: | Application Number: US202217950120 |