SUBSTRATE FIXING DEVICE

A substrate fixing device includes a base plate having a first bonding surface, an electrostatic chuck having a substrate placement surface on which a substrate is placed and a second bonding surface provided on a side opposite to the substrate placement surface, and configured to attract and hold t...

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Bibliographic Details
Main Author Kusama, Yasuhiko
Format Patent
LanguageEnglish
Published 29.02.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A substrate fixing device includes a base plate having a first bonding surface, an electrostatic chuck having a substrate placement surface on which a substrate is placed and a second bonding surface provided on a side opposite to the substrate placement surface, and configured to attract and hold the substrate, and an adhesive layer configured to bond the first bonding surface of the base plate and the second bonding surface of the electrostatic chuck. The electrostatic chuck includes a recess provided in the second bonding surface, an electronic component accommodated in the recess, and a layer having a filling portion configured to fill the recess and a protruding portion protruding from the recess and having a tip end in contact with the first bonding surface.
Bibliography:Application Number: US202318454407