STRESS AND WARPAGE IMPROVEMENTS FOR STIFFENER RING PACKAGE WITH EXPOSED DIE(S)
A package, and method for building the package is disclosed. The package includes a substrate having a first surface. The package further includes a die having opposing first and second surfaces, and a lateral surface, with the second surface of the die coupled to the first surface of the substrate....
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Main Author | |
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Format | Patent |
Language | English |
Published |
01.02.2024
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Subjects | |
Online Access | Get full text |
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Summary: | A package, and method for building the package is disclosed. The package includes a substrate having a first surface. The package further includes a die having opposing first and second surfaces, and a lateral surface, with the second surface of the die coupled to the first surface of the substrate. The package further includes a stiffener element having a first surface and a lateral surface, with the first surface of the stiffener element coupled to the first surface of the substrate. The package further includes molding material disposed on the first surface of the substrate and the lateral surface of the die. The coefficient of thermal expansion (CTE) value of the molding material is greater than a CTE value of the die. The first molding surface of the molding material is coplanar with the first surface of the die. |
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Bibliography: | Application Number: US202217873583 |