STRESS AND WARPAGE IMPROVEMENTS FOR STIFFENER RING PACKAGE WITH EXPOSED DIE(S)

A package, and method for building the package is disclosed. The package includes a substrate having a first surface. The package further includes a die having opposing first and second surfaces, and a lateral surface, with the second surface of the die coupled to the first surface of the substrate....

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Bibliographic Details
Main Author Zhao, Sam Ziqun
Format Patent
LanguageEnglish
Published 01.02.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A package, and method for building the package is disclosed. The package includes a substrate having a first surface. The package further includes a die having opposing first and second surfaces, and a lateral surface, with the second surface of the die coupled to the first surface of the substrate. The package further includes a stiffener element having a first surface and a lateral surface, with the first surface of the stiffener element coupled to the first surface of the substrate. The package further includes molding material disposed on the first surface of the substrate and the lateral surface of the die. The coefficient of thermal expansion (CTE) value of the molding material is greater than a CTE value of the die. The first molding surface of the molding material is coplanar with the first surface of the die.
Bibliography:Application Number: US202217873583